Page 4 - MODCOMP NEWSLETTER 1

Objective 1: Development of CF-based composites with multi-functionalities (i.e. a combination of en-
hanced mechanical properties, electrical conductivity, thermal stability, flexibility) by the incorporation of
nanomaterials.

Objective 2: Development of cost-effective manufacturing processes which consider sustainability and re-
cycling/energy (new (bio) - precursors/ bioresins and life cycle), and safety (safe-by-design and toxicology).

Objective 3: Evaluation of new configurations in lighter structural composite taking advantage of nanotech-
nologies to sustain damage from lightning strike for Zone 2A of the Horizontal Tail Plane.

Objective 4: Looking for the optimum processes and the best multiscale reinforcement combinations using
synergistically experimental testing and analytical together with computational modelling techniques.

Objective 5: Use of the CF-based materials developed from MODCOMP to re-design final products with re-
duced weight (>20%), increased stiffness (>20%) and enhanced performance (faster response to driver ac-
tions and improved safety).

Objective 6: Demonstration of innovative secure storage modules, flat pack shelter system and training
sailing craft with reduced cost and high performance (corrosion, UV and abrasion resistance, rigidity and
increased thermal properties).

Objective 7: Promotion of the exploitation of industrial-preferred composite materials and standardize ac-
tivities throughout the production chain.

Objective 8: Dissemination of outputs for raising the profile of the new MODCOMP technologies.

Objective 9: Identification of new potential market for the developed fibre-based composite materials in
avionics, construction, and electronics industry.

Objective 10: Evaluation of the industrial impact of MODCOMP-concept with respect to economic as well
as technical aspects.

Objective 11: Opening a new field of innovation based on materials and technologies development and
push for the industrial leadership of Europe in strategic domains (electronics, defence, aerospace).